Theem I: Thaum ntxov chip foundries muaj cov txiaj ntsig zoo. Lawv tsuas yog siv 100-150mm magnetron sputtering tshuab nrog lub zog qis.Cov zaj duab xis sputtering yog tuab thiab nti loj.
Lub sijhawm ntawd,titanium cov hom phiajrau integrated circuits mas yog 100-150mm monomer thiab composite lub hom phiaj.
Theem Ⅱ:
Nyob rau theem thib ob, raws li Moore txoj cai, lub nti kab dav yuav nqaim. Txhawm rau kom tau txais txiaj ntsig ntau ntxiv, lub chip foundry tau nce lub zog sputtering ntawm cov cuab yeej siv, feem ntau yog siv 150-200mm sputtering khoom. Qhov no yuav tsum tau nce qhov loj ntawm lub hom phiaj thaum tswj cov thermal conductivity siab, tus nqi qis, thiab qee lub zog. Lub sijhawm no,titanium cov hom phiajyog tsim los ntawm diffusion vuam ntawm aluminium alloy backplane thiab brazing thiab vuam ntawm tooj liab alloy backplane.
Phase III:
Nyob rau theem thib peb, nrog rau kev txhim kho ntawm kev sib xyaw ua ke, qhov dav ntawm cov kab nti yog ntxiv nqaim. Lub sijhawm no, chip foundries feem ntau yog siv 200-300mm sputtering tshuab, thiab cov kev xav tau rau cov khoom siv tau nruj dua. Thaum lub sij hawm no, lubTi sibFeem ntau yog ua los ntawm tooj liab alloy backplate diffusion vuam.
